The rise of AI-driven perception, sensor fusion, and autonomous control is placing unprecedented demands on compute architectures in next-generation vehicles. As chip complexity and performance requirements surge, traditional packaging technologies are reaching their limits. This session explores how ultra-high-density interconnect (UHDI) substrates and advanced packaging solutions—such as chiplets and heterogeneous integration—are redefining the boundaries of automotive-grade silicon performance. Harald Gall from AT&S will showcase how cutting-edge IC substrate innovations are enabling the miniaturization, thermal management, and signal integrity required for future-ready ADAS and AI workloads. Learn how these developments are supporting the industry’s shift toward zonal computing and domain controllers while meeting stringent automotive standards.

In this session, we will discuss:

• UHDI substrates for chiplets: unlocking high-bandwidth, low-latency interconnects in multi-die systems
• Enabling heterogeneous integration: merging logic, memory, and analog components for ADAS and AI use cases
• Packaging challenges for high-performance compute in harsh automotive environments (thermal, mechanical, reliability)
• Strategic role of advanced packaging in scaling edge AI and centralized processing architectures